Nav: QuadPulser

Notes 9/7/17

Layout/Schematic - Critical

• Move FMCCLK2 pair to LA29 (G30/G31) of FC (Done HL)
• Update footprint on flash to match drawing (Done HL)
• Delete spurious trace/via to left of P1-7 (Done HL)
• U21 needs a pin 1 mark (Done HL)
• Fix FPGA footprint. Should have .016 diameter pads, not .019. See page 13 of this doc (we are using an FTG256 package) (Done HL)

​https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

• All thru-hole component pads must have thermal relief on all planes (Done -Eric)
• Solder mask openings are too big on most components. It seems as if the openings are .004 larger per side, .002 is preferred. (Done - Eric)
• Silkscreen text needs a quick editing pass to remove overlapping text here and there (Done - Eric)

BOM Issues

• Specify VQFN package for level shifters (LVC8T245) (Done HL)

Desired

• What is with the resistors on the mounting holes? They should be plated-thru holes (normal pads) just connected to the ground plane. Please delete R165...R170 and ground MH1-MH6. (Done HL)
• Why are C1 and C2 different sizes? (Done HL)

Older Notes

• ADC clock must be external (from FMC) OK
  • Probably should have jitter cleaner OK
• Check FMC pinout for compatibility with FMC on Enclustra base board for tesing: ​PM3 Manual OK
• Silkscreen should have "edf.bu.edu" OK
• Check clearance on power planes, should be at least .010 from pads and traces